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| Imagen | Modelo | Precio | Cantidad | Existencias | Fabricant | Descripción | Series | Part Status | Material | Type | Shape | Length | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Square | 0.790" (20.07mm) | BGA | Thermal Tape, Adhesive (Not Included) | 0.155" (3.94mm) | 1.0W @ 40°C | 20.00°C/W @ 200 LFM | Black Anodized |
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