- Part Status :
- Type :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
- Filtrado seleccionado :
82 Productos
| Imagen | Modelo | Precio | Cantidad | Existencias | Fabricant | Descripción | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Ver |
2,298
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||
|
|
Ver |
3,242
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK TO-263 19.38X25.40MM | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | - | - | 23.00°C/W | Tin | ||
|
|
Ver |
1,222
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Ver |
3,147
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Ver |
1,326
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
Ver |
3,770
Tenemos efectivo.
|
Assmann WSW Components | HEAT SINK ALUM DPAK TO-252 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | D²Pak, TO-252 | SMD Pad | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
|
|
Ver |
3,252
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK TO-263 12.70X26.20MM | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
|
|
Ver |
3,886
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||
|
|
Ver |
872
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .45" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
Ver |
3,327
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
|
Ver |
2,594
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
|
Ver |
3,374
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
Ver |
979
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
|
Ver |
3,136
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
Ver |
2,431
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D-PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
Ver |
701
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
|
|
Ver |
3,491
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Ver |
2,852
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Ver |
3,966
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
Ver |
2,557
Tenemos efectivo.
|
Assmann WSW Components | HEAT SINK ALUM DPAK TO-252 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | D²Pak, TO-252 | SMD Pad | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
|
|
|
Ver |
1,153
Tenemos efectivo.
|
Assmann WSW Components | HEAT SINK ALUM DPAK TO-252 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | D²Pak, TO-252 | SMD Pad | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
|
|
|
Ver |
3,128
Tenemos efectivo.
|
Assmann WSW Components | HEAT SINK ALUM DPAK TO-252 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | D²Pak, TO-252 | SMD Pad | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
|
|
|
Ver |
3,447
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | - | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
Ver |
1,275
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK TO-263 12.70X26.20MM | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
|
|
|
Ver |
2,820
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK TO-263 12.70X26.20MM | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
|
|
|
Ver |
2,443
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK TO-263 12.70X26.20MM | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
|
|
|
Ver |
2,298
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||
|
|
|
Ver |
3,242
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK TO-263 19.38X25.40MM | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | - | - | 23.00°C/W | Tin | ||
|
|
|
Ver |
1,222
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Ver |
3,147
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin |
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