- Height Off Base (Height of Fin) :
- Thermal Resistance @ Forced Air Flow :
- Filtrado seleccionado :
2 Productos
Imagen | Modelo | Precio | Cantidad | Existencias | Fabricant | Descripción | Series | Part Status | Material | Type | Shape | Length | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Ver |
3,290
Tenemos efectivo.
|
Wakefield-Vette | HEATSINK CPU 25MM SQUARE W/TAPE | 624 | Obsolete | Aluminum | Top Mount | Square, Pin Fins | 0.827" (21.00mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.350" (8.89mm) | 15.00°C/W @ 400 LFM | Black Anodized | ||
|
|
Ver |
3,697
Tenemos efectivo.
|
Wakefield-Vette | HEATSINK CPU 21MM SQ W/DBL TAPE | 624 | Obsolete | Aluminum | Top Mount | Square, Pin Fins | 0.827" (21.00mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 25.00°C/W @ 200 LFM | Black Anodized |
1 / 1 Página