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Height Off Base (Height of Fin) :
Thermal Resistance @ Forced Air Flow :
2 Productos
Imagen Modelo Precio Cantidad Existencias Fabricant Descripción Series Part Status Material Type Shape Length Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Material Finish
Default Photo
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RFQ
3,290
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Wakefield-Vette HEATSINK CPU 25MM SQUARE W/TAPE 624 Obsolete Aluminum Top Mount Square, Pin Fins 0.827" (21.00mm) - BGA Thermal Tape, Adhesive (Included) 0.350" (8.89mm) 15.00°C/W @ 400 LFM Black Anodized
624-25ABT4
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RFQ
3,697
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Wakefield-Vette HEATSINK CPU 21MM SQ W/DBL TAPE 624 Obsolete Aluminum Top Mount Square, Pin Fins 0.827" (21.00mm) - BGA Thermal Tape, Adhesive (Included) 0.250" (6.35mm) 25.00°C/W @ 200 LFM Black Anodized