3 Productos
| Imagen | Modelo | Precio | Cantidad | Existencias | Fabricant | Descripción | Series | Part Status | Material | Type | Shape | Length | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Ver |
2,579
Tenemos efectivo.
|
CTS Thermal Management Products | HEATSINK CPU W/ADHESIVE 1.11"SQ | BDN | Active | Aluminum | Top Mount | Square, Pin Fins | 1.110" (28.19mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.355" (9.02mm) | 7.20°C/W @ 400 LFM | 20.90°C/W | Black Anodized | ||
|
|
|
Ver |
2,579
Tenemos efectivo.
|
CTS Thermal Management Products | HEATSINK CPU W/ADHESIVE 1.11"SQ | BDN | Active | Aluminum | Top Mount | Square, Pin Fins | 1.110" (28.19mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.355" (9.02mm) | 7.20°C/W @ 400 LFM | 20.90°C/W | Black Anodized | ||
|
|
|
Ver |
2,579
Tenemos efectivo.
|
CTS Thermal Management Products | HEATSINK CPU W/ADHESIVE 1.11"SQ | BDN | Active | Aluminum | Top Mount | Square, Pin Fins | 1.110" (28.19mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.355" (9.02mm) | 7.20°C/W @ 400 LFM | 20.90°C/W | Black Anodized |
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