- Part Status :
- Type :
- Package Cooled :
7 Productos
| Imagen | Modelo | Precio | Cantidad | Existencias | Fabricant | Descripción | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Ver |
2,298
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | Tin | ||
|
|
Ver |
3,886
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | Tin | ||
|
|
|
Ver |
2,298
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | Tin | ||
|
|
|
Ver |
3,886
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | Tin | ||
|
|
|
Ver |
2,446
Tenemos efectivo.
|
Comair Rotron | HEATSINK STAMP 25.9X15X9.5MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak) | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | Tin | ||
|
|
|
Ver |
2,298
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | Tin | ||
|
|
|
Ver |
3,886
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | Tin |
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