- Part Status :
- Material :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Material Finish :
- Filtrado seleccionado :
46 Productos
| Imagen | Modelo | Precio | Cantidad | Existencias | Fabricant | Descripción | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Ver |
2,656
Tenemos efectivo.
|
Ohmite | BLACK ANODIZED HEATSINK | EX | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.641" (16.28mm) | 0.642" (16.30mm) | - | TO-247 | Bolt On and Board Mounts | 1.500" (38.10mm) | 4.0W @ 70°C | 4.00°C/W @ 300 LFM | 14.00°C/W | Black Anodized | ||
|
|
Ver |
3,236
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 2.185" (55.50mm) | 1.378" (35.00mm) | - | TO-220 | Bolt On and Board Mounts | 0.500" (12.70mm) | - | - | 14.00°C/W | Tin | ||
|
|
Ver |
2,251
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Top Mount | Square, Fins | 0.669" (17.00mm) | 0.669" (17.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Bolt On and Board Mounts | 0.500" (12.70mm) | - | - | 14.00°C/W | Black Anodized | ||
|
|
Ver |
839
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK TOP-3 TO-220 SOT-32 | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.374" (34.90mm) | - | SOT-32, TO-220, TOP-3 | Bolt On and PC Pin | 0.500" (12.70mm) | - | - | 14.00°C/W | Black Anodized | ||
|
|
Ver |
3,231
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | PC Pin | 0.500" (12.70mm) | - | - | 14.00°C/W | Black Anodized | ||
|
|
Ver |
1,222
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Ver |
3,147
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Ver |
1,326
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
Ver |
3,447
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | - | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
Ver |
3,187
Tenemos efectivo.
|
Wakefield-Vette | HEATSINK VERT ALUM BLACK TO-220 | 265 | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 4.0W @ 56°C | 7.00°C/W @ 200 LFM | 14.00°C/W | Black Anodized | ||
|
|
Ver |
3,539
Tenemos efectivo.
|
Wakefield-Vette | HEATSINK VERT ALUM BLK TO-220 | 206 | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 4.0W @ 56°C | 7.30°C/W @ 200 LFM | 14.00°C/W | Black Anodized | ||
|
|
Ver |
3,918
Tenemos efectivo.
|
Ohmite | BLACK ANODIZED HEATSINK | EX | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.641" (16.28mm) | 0.642" (16.30mm) | - | TO-220 | Bolt On and Board Mounts | 1.500" (38.10mm) | 3.0W @ 50°C | 5.00°C/W @ 200 LFM | 14.00°C/W | Black Anodized | ||
|
|
Ver |
3,489
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Top Mount | Square, Fins | 1.457" (37.00mm) | 1.374" (34.90mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Bolt On and PC Pin | 0.500" (12.70mm) | - | - | 14.00°C/W | Black Anodized | ||
|
|
Ver |
3,358
Tenemos efectivo.
|
Wakefield-Vette | HEATSINK TO-5 EPOXY INSUL BLK | 260 | Active | Beryllium Copper | Board Level | Cylindrical | 0.370" (9.40mm) | 0.380" (9.65mm) | 0.290" (7.37mm) ID | TO-5 | Bolt On | - | - | - | 14.00°C/W | Black Ebonol | ||
|
|
|
Ver |
2,656
Tenemos efectivo.
|
Ohmite | BLACK ANODIZED HEATSINK | EX | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.641" (16.28mm) | 0.642" (16.30mm) | - | TO-247 | Bolt On and Board Mounts | 1.500" (38.10mm) | 4.0W @ 70°C | 4.00°C/W @ 300 LFM | 14.00°C/W | Black Anodized | ||
|
|
|
Ver |
3,236
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 2.185" (55.50mm) | 1.378" (35.00mm) | - | TO-220 | Bolt On and Board Mounts | 0.500" (12.70mm) | - | - | 14.00°C/W | Tin | ||
|
|
|
Ver |
2,251
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Top Mount | Square, Fins | 0.669" (17.00mm) | 0.669" (17.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Bolt On and Board Mounts | 0.500" (12.70mm) | - | - | 14.00°C/W | Black Anodized | ||
|
|
|
Ver |
839
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK TOP-3 TO-220 SOT-32 | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.374" (34.90mm) | - | SOT-32, TO-220, TOP-3 | Bolt On and PC Pin | 0.500" (12.70mm) | - | - | 14.00°C/W | Black Anodized | ||
|
|
|
Ver |
3,231
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | PC Pin | 0.500" (12.70mm) | - | - | 14.00°C/W | Black Anodized | ||
|
|
|
Ver |
1,222
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Ver |
3,147
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Ver |
1,326
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Ver |
3,447
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | - | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Ver |
3,187
Tenemos efectivo.
|
Wakefield-Vette | HEATSINK VERT ALUM BLACK TO-220 | 265 | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 4.0W @ 56°C | 7.00°C/W @ 200 LFM | 14.00°C/W | Black Anodized | ||
|
|
|
Ver |
3,539
Tenemos efectivo.
|
Wakefield-Vette | HEATSINK VERT ALUM BLK TO-220 | 206 | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 4.0W @ 56°C | 7.30°C/W @ 200 LFM | 14.00°C/W | Black Anodized | ||
|
|
|
Ver |
3,918
Tenemos efectivo.
|
Ohmite | BLACK ANODIZED HEATSINK | EX | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.641" (16.28mm) | 0.642" (16.30mm) | - | TO-220 | Bolt On and Board Mounts | 1.500" (38.10mm) | 3.0W @ 50°C | 5.00°C/W @ 200 LFM | 14.00°C/W | Black Anodized | ||
|
|
|
Ver |
3,489
Tenemos efectivo.
|
Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Top Mount | Square, Fins | 1.457" (37.00mm) | 1.374" (34.90mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Bolt On and PC Pin | 0.500" (12.70mm) | - | - | 14.00°C/W | Black Anodized | ||
|
|
|
Ver |
3,358
Tenemos efectivo.
|
Wakefield-Vette | HEATSINK TO-5 EPOXY INSUL BLK | 260 | Active | Beryllium Copper | Board Level | Cylindrical | 0.370" (9.40mm) | 0.380" (9.65mm) | 0.290" (7.37mm) ID | TO-5 | Bolt On | - | - | - | 14.00°C/W | Black Ebonol | ||
|
|
|
Ver |
7,523
Tenemos efectivo.
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | Active | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | TO-268 (D³Pak) | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | |||||
|
|
|
Ver |
3,650
Tenemos efectivo.
|
Wakefield-Vette | HEAT SINK FOR TO-5 PKG | 260 | Active | Beryllium Copper | Board Level | Cylindrical | 0.557" (14.15mm) | 0.370" (9.40mm) | 0.290" (7.37mm) ID | TO-5 | Bolt On | - | - | - | 14.00°C/W | Black Ebonol |
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