Creación de plataformas comerciales fiables para los fabricantes y proveedores mundiales.
6 Productos
Imagen Modelo Precio Cantidad Existencias Fabricant Descripción Series Part Status Packaging Operating Temperature Mounting Type Package / Case Interface Supplier Device Package Number of Circuits Voltage - Supply Function
DS34S132GN
Ver
RFQ
819
Tenemos efectivo.
Maxim Integrated IC TDM/PACKET TRANSPORT 676BGA - Discontinued at Digi-Key Tray -40°C ~ 85°C Surface Mount 676-BGA TDMoP 676-TEPBGA (27x27) 1 1.8V, 3.3V TDM-over-Packet (TDMoP)
DS34S132GNA2+
Unidad
$209.8303
Ver
RFQ
3,407
Tenemos efectivo.
Maxim Integrated IC TDM PACKET 32PORT 676PBGA - Not For New Designs Tray -40°C ~ 85°C Surface Mount 676-BGA TDMoP 676-TEPBGA (27x27) 1 1.8V, 3.3V TDM-over-Packet (TDMoP)
DS34S132GN+
Unidad
$271.9500
Ver
RFQ
1,334
Tenemos efectivo.
Maxim Integrated IC TDM OVER PACKET 676-BGA - Active Tray -40°C ~ 85°C Surface Mount 676-BGA TDMoP 676-TEPBGA (27x27) 1 1.8V, 3.3V TDM-over-Packet (TDMoP)
DS34S132GN
Ver
RFQ
819
Tenemos efectivo.
Maxim Integrated IC TDM/PACKET TRANSPORT 676BGA - Discontinued at Digi-Key Tray -40°C ~ 85°C Surface Mount 676-BGA TDMoP 676-TEPBGA (27x27) 1 1.8V, 3.3V TDM-over-Packet (TDMoP)
DS34S132GNA2+
Unidad
$209.8303
Ver
RFQ
3,407
Tenemos efectivo.
Maxim Integrated IC TDM PACKET 32PORT 676PBGA - Not For New Designs Tray -40°C ~ 85°C Surface Mount 676-BGA TDMoP 676-TEPBGA (27x27) 1 1.8V, 3.3V TDM-over-Packet (TDMoP)
DS34S132GN+
Unidad
$271.9500
Ver
RFQ
1,334
Tenemos efectivo.
Maxim Integrated IC TDM OVER PACKET 676-BGA - Active Tray -40°C ~ 85°C Surface Mount 676-BGA TDMoP 676-TEPBGA (27x27) 1 1.8V, 3.3V TDM-over-Packet (TDMoP)