- Part Status :
- Filtrado seleccionado :
2 Productos
| Imagen | Modelo | Precio | Cantidad | Existencias | Fabricant | Descripción | Series | Part Status | Packaging | Mounting Type | Applications | Package / Case | Type | Supplier Device Package | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Ver |
1,819
Tenemos efectivo.
|
Maxim Integrated | IC TDM OVER PACKET 484HSBGA | - | Not For New Designs | Tray | Surface Mount | Data Transport | 484-BGA Exposed Pad | TDM (Time Division Multiplexing) | 484-HSBGA (23x23) | ||
|
|
Ver |
1,634
Tenemos efectivo.
|
Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | - | Active | Tray | Surface Mount | Data Transport | 484-BGA Exposed Pad | TDM (Time Division Multiplexing) | 484-HSBGA (23x23) |
1 / 1 Página
